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AMD Instinct MI355X

AMD's data-center GPU for AI, introduced in June 2025 on the CDNA 4 architecture, with 288 GB of HBM3E memory and very high low-precision throughput aimed at generative AI inference, positioned against Nvidia's Blackwell generation.

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Memory (GB)
288
Memory bandwidth (GB/s)
8000
Release date
Developer
AMD

What the MI355X is

The AMD Instinct MI355X is a data-center graphics processor (GPU) built for artificial-intelligence workloads. It belongs to AMD's Instinct MI350 series, which the company introduced on 12 June 2025.[1] The chip is based on CDNA 4, the architecture AMD uses for its compute-oriented Instinct accelerators rather than for graphics cards whose job is drawing images.[1]

Accelerators of this kind are not desktop parts. They are mounted several to a server, and the server is what a cloud provider or a research lab actually buys. Most of the numbers below therefore describe a single chip, while the most useful number for a buyer — how much memory and how much throughput a whole machine has — is the one given for an eight-GPU platform.

Memory and arithmetic

AMD's specification table lists 288 GB of HBM3E memory and 8 TB/s of memory bandwidth for the MI355X.[1] HBM (high-bandwidth memory) is made by stacking memory dies vertically and placing them on the same package as the processor, which shortens the distance data travels between compute and memory and allows very high transfer rates. Capacity matters because the weights of a large model, plus the intermediate values that accumulate while the model answers a long prompt, all have to fit in memory; when they do not fit, work has to be split across chips or moved back and forth over slower links.

On the compute side, AMD lists up to 256 compute units per chip.[1] A compute unit is one of the repeated processing blocks that a GPU switches between to keep its arithmetic pipelines busy; more of them, at a given clock speed, means more parallel work in flight.

The published precision table gives 78.6 teraflops of FP64 and 2.5 petaflops of FP16 matrix performance.[1] FP64, double precision, is the format still used in parts of scientific simulation; FP16, half precision, is the format most machine-learning work moved to years ago. The table also lists 5 petaflops of MXFP8/OCP-FP8, 10.1 petaflops of MXFP6 and 10.1 petaflops of MXFP4 matrix performance.[1] The MX formats are microscaling formats: values are stored in small blocks that share one scale factor, so a block can use short 8-, 6- or 4-bit numbers without losing too much range. Cutting the bits per value roughly doubles the number of values a chip can process in the same time, which is why the MXFP8 figure is half the MXFP4 figure. The pattern in the table — a comparatively small FP64 number next to very large low-precision numbers — reflects a chip shaped around inference and training of neural networks rather than around traditional double-precision simulation.

Whole systems, power and cooling

AMD says an eight-GPU MI355X platform provides 2.3 TB of HBM3E and 80.5 petaflops of MXFP4 performance.[1] Those are the figures that describe a complete server node, and they are the ones that determine which models fit on one machine.

AMD's Chinese-language specification table lists a typical board power of up to 1,400 W for the MI355X and says it uses direct liquid cooling.[2] Direct liquid cooling means coolant is piped to a cold plate attached to the chip instead of relying on air pushed through the chassis by fans. At board powers in the four-digit-watt range, air alone becomes impractical, so liquid cooling is a design requirement rather than an option.

Software and availability

AMD launched ROCm 7 alongside the MI350 series.[1] ROCm is AMD's software platform for GPU computing: the layer that compilers, numerical libraries and machine-learning frameworks build on. A chip is only usable in practice if the software stack supports the operations a model needs, so a new release of the stack is part of the product launch, not an accessory to it.

AMD says the MI350 series is available through major cloud providers and is integrated into systems by Dell, HPE and Supermicro.[1] Cloud availability matters because many teams never buy accelerators directly; they rent them by the hour.

Where it sits

AMD positioned the MI350 series against Nvidia's Blackwell generation for generative AI inference, and described a 35-fold inference improvement over its own CDNA 3 accelerators.[1] Inference is the act of running an already-trained model to produce answers, as distinct from training, and it is the workload that dominates the cost of serving a chatbot. Comparisons of this kind depend on which models, batch sizes, precisions and software versions were used, so the headline multiple describes a particular measurement rather than a universal ratio.

Version history

5
  1. 2023
    • Dec 6, 2023 AMD Instinct MI300X

      AMD's data-center GPU for generative AI, released in December 2023. Built on the CDNA 3 architecture with a chiplet design, it leads with 192 GB of HBM3 memory, which AMD contrasted with the 80 GB on Nvidia's H100.

  2. 2024
    • Oct 10, 2024 AMD Instinct MI325X

      A data-center GPU announced by AMD on 10 October 2024, built on third-generation CDNA with 256 GB of HBM3E memory at 6 TB/s and aimed at models with a trillion parameters.

  3. 2025
    • Jun 12, 2025 AMD Instinct MI350X

      AMD Instinct MI350X is a data-center GPU in AMD's MI350 series, built on the CDNA 4 architecture with up to 288 GB of HBM3E memory, up to 8 TB/s of bandwidth and a 1,000 W board power.

    • Jun 12, 2025 AMD Instinct MI355X · This page

      AMD's data-center GPU for AI, introduced in June 2025 on the CDNA 4 architecture, with 288 GB of HBM3E memory and very high low-precision throughput aimed at generative AI inference, positioned against Nvidia's Blackwell generation.

  4. 2026
    • 2026 AMD Instinct MI400

      The AMD Instinct MI400 is AMD's next-generation data-center GPU for AI, expected in 2026 with 432 GB of HBM4 memory, and designed to be deployed inside AMD's Helios rack-scale system.

20261

  1. MilestoneTSMC CoWoS packaging stays sold out as AI demand outruns capacity

    TSMC's CoWoS advanced packaging places logic dies and HBM stacks on a silicon interposer; capacity remains sold out, and TSMC is expanding in Tainan and Chiayi while developing panel-level CoPoS.

Developed by1

AMD

Successor of1

AMD Instinct MI350X

Succeeded by1

AMD Instinct MI400

Notes and sources

  1. AMD Instinct MI350 Series and Beyondhttps://www.amd.com/en/blogs/2025/amd-instinct-mi350-series-and-beyond-accelerating-the-future-of-ai-and-hpc.html
  2. AMD Instinct MI350 系列顯示卡https://www.amd.com/zh-tw/partner/browse-by-resource/partner-insights-articles/instinct-mi350x-data-center-ai-leadership.html

Cite this page: AMD Instinct MI355X. TellWorld, https://www.tellworld.net/compute/amd-instinct-mi355x. Updated 2026-11-08