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Huawei

Huawei is a Chinese information and communications technology company founded in Shenzhen in 1987. It designs its own Ascend AI chips and the software and large computing systems built around them.

Founded 1987Website huawei.com

What Huawei is

Huawei is a Chinese information and communications technology company, founded in 1987 in Shenzhen by Ren Zhengfei. The company says it has about 213,000 employees and operates in more than 170 countries and regions; it also says it is 100% privately owned by its employees.[1] Its 2025 annual report gives revenue of CNY 880.9 billion and net profit of CNY 68 billion.[6]

Research and chip design

A large share of the company's resources goes into research. The 2025 annual report states R&D spending of CNY 192.3 billion, equal to 21.8% of revenue, and Huawei says about 53.7% of its workforce works in R&D. Its chips are designed by its subsidiary HiSilicon.[6]

Announcing an AI strategy

Huawei set out its AI plans in public at HUAWEI CONNECT 2018 in Shanghai on 10 October 2018. There Rotating Chairman Eric Xu announced the company's AI strategy and its Ascend series of AI chips, presented as part of a "full-stack, all-scenario" AI portfolio — a way of saying the company meant to supply not a single component but chips, software and the systems built around them.[3]

The hardware arrived in steps. Huawei launched the Ascend 310 chip in 2018, and in August 2019 it brought out the Ascend 910 training chip together with the MindSpore framework.[2] Huawei says the Ascend 910C became better known in 2025 as the company scaled up deployment of its Atlas 900 A3 SuperPoD.[2]

Export restrictions

On 15 May 2019 the US Department of Commerce added Huawei and 70 of its affiliates to the Entity List, restricting its access to US technology.[2] The Entity List is a US export-control instrument: a party placed on it faces limits on which US technology it may obtain.

Chips and systems

In September 2025 Huawei announced the Ascend 950, 960 and 970 chip series, a plan covering the next three years: the Ascend 950DT is due in the fourth quarter of 2026 and the Ascend 960 in the fourth quarter of 2027, and the company pledged to open-source its CANN software.[5]

At HUAWEI CONNECT 2025 on 18 September 2025 it also unveiled the Atlas 950 SuperPoD with 8,192 Ascend NPUs and the Atlas 960 SuperPoD with 15,488, together with SuperClusters of over 500,000 and over one million NPUs.[4]

How the pieces fit together

An NPU (neural processing unit) is a processor built for the kind of arithmetic neural networks do — very large numbers of multiply-and-add operations. A SuperPoD is a way of wiring many such processors together so that they can be used as one machine; a SuperCluster extends the same idea to a much larger collection of those pods. On the software side, MindSpore is the framework in which models are written, and CANN is the software Huawei supplies for its Ascend chips.

Read together, the announcements describe a stack that runs from chip design at HiSilicon, through the Ascend chips themselves, to the software and to the racks and clusters built from them. They also describe a schedule: the 2025 announcements named chips due in 2026 and 2027, so the plan reaches several generations ahead in public. The Ascend 910C is a case of the same pattern — a chip that Huawei says became better known only once the larger Atlas 900 A3 SuperPoD system around it was deployed at scale.[2]

ApplicationsEnterprise

Ecosystem & regionChinaCloudHardware & compute

20254

  1. ReleaseHuawei publishes three-year Ascend roadmap

    At Huawei Connect 2025 in Shanghai, Huawei published its first three-year Ascend chip roadmap, running to 2028, alongside new Atlas SuperPoD systems and a pledge to open source CANN.

  2. PolicyCommerce rescinds the AI Diffusion Rule

    On 13 May 2025, the US Commerce Department moved to rescind the AI Diffusion Rule two days before its compliance date, told officials not to enforce it, and issued guidance on Huawei Ascend chips and Chinese AI model training.

  3. ReleaseHuawei launches Qiankun ADS 4 with a highway L3 version

    On 22 April 2025 Huawei released Qiankun ADS 4, HarmonySpace 5 and the XMC vehicle control system in Shanghai, claiming 600 million kilometres of highway L3 simulation and a 2025 target for L3 commercial capability.

  4. ReleaseHuawei launches the Atlas 900 A3 SuperPoD

    Huawei's Atlas 900 A3 SuperPoD, launched in March 2025, links up to 384 Ascend 910C chips into one logical computer rated at up to 300 PFLOPS, and is sold in cloud form as CloudMatrix384.

Models and products over time

8
  1. 2019
    • Aug 23, 2019 Huawei Ascend 910 Chip

      Huawei's Ascend 910 is an AI training processor launched in 2019 alongside the MindSpore framework, rated at 256 teraflops FP16 and used to train the PanGu-α language models on clusters of thousands of chips.

  2. 2023
    • 2023 Huawei Ascend 910B Chip

      Huawei's Ascend 910B is a 2023 volume-production AI chip rated at 320 TFLOPS of FP16, with 32 GB of HBM2e memory, 1.6 TB/s of bandwidth and a 310 W envelope on a 7-nanometer domestic process.

  3. 2025
    • 2025 Huawei Ascend 910C Chip

      Huawei's Ascend 910C is a data-center AI chip in the 910 series, built on the Da Vinci architecture. It reached the market in the first quarter of 2025 with 800 TFLOPS of FP16 compute and 128 GB of HBM.

    • 2025 Huawei CloudMatrix 384 Chip

      Huawei CloudMatrix384 is a Huawei Cloud service instance built on Atlas 900 A3 SuperPoDs, each linking up to 384 Ascend 910C chips so that they work as one computer.

    • Apr 22, 2025 Huawei Qiankun ADS 4 Product

      Huawei's intelligent driving system released in Shanghai on 22 April 2025, built on a cloud-plus-vehicle WEWA architecture and offered in four versions, the flagship carrying a dedicated highway L3 package.

    • Sep 18, 2025 Huawei Ascend 950 Chip

      Huawei's Ascend 950 is a two-chip AI series announced in September 2025, pairing a shared die with Huawei's own high bandwidth memory, up to 2 PFLOPS in low precision formats and 2 TB/s interconnect.

    • Sep 18, 2025 Huawei Ascend 960 Chip

      The Ascend 960 is a Huawei AI chip on the company's three-year roadmap, slated for the fourth quarter of 2027 with twice the compute, memory and interconnect ports of the Ascend 950 and support for Huawei's HiF4 4-bit format.

    • Sep 18, 2025 Huawei Ascend 970 Chip

      Huawei's Ascend 970 is a planned AI chip announced in September 2025 as the last entry on the company's published roadmap, targeted for the fourth quarter of 2028 with roughly double the compute and wider interconnect and memory bandwidth than the Ascend 960.

Notes and sources

  1. Corporate Informationhttps://www.huawei.com/en/corporate-information
  2. Huaweihttps://en.wikipedia.org/wiki/Huawei
  3. Huawei Releases AI Strategyhttps://e.huawei.com/my/news/ebg/201810101135
  4. Huawei Unveils World's Most Powerful SuperPoDs and SuperClustershttps://www.huawei.com/en/news/2025/9/hc-lingqu-ai-superpod
  5. Groundbreaking SuperPoD Interconnect: Leading a New Paradigm for AI Infrastructurehttps://www.huawei.com/en/news/2025/9/hc-xu-keynote-speech
  6. 2025 Annual Reporthttps://www.huawei.com/en/news/2026/3/annual-report-2025

Cite this page: Huawei. TellWorld, https://www.tellworld.net/companies/huawei. Updated 2026-11-08