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Marvell agreed on 2 November 2026 to buy optical chip and networking equipment maker Lumentum in an all-stock deal valued at $115 billion including debt, one of the largest technology acquisitions on record.
On 22 October 2026 iFlytek released Spark X2.6, a device-cloud model series, at its developer festival in Beijing. The same event also launched a speech foundation model and a digital-employee platform.
On 15 October 2026 Meta released Muse Spark Open, an open-weight, natively multimodal model with 816 billion total parameters, optimised to run on Apple's Mac Studio. Its weights were published on Hugging Face.
On 22 September 2026 PixVerse announced R2, a scaling release of its real-time world model that adds more data, tasks and input types at the same latency, and showed it running playable, prompt-editable worlds.
Character.ai's CAI-Image family consists of image models post-trained from open-source Qwen-Image and tuned for character-driven storytelling, so the same character stays recognisable across styles, scenes and pages. The company announced the models on 16 September 2026.
On 8 September 2026 Mistral AI announced a €3 billion Series D led by Samsung Electronics, valuing the company at more than €21 billion after the round.
On 3 September 2026 Nvidia agreed to acquire Hugging Face for $12.93 billion. Hugging Face said it would remain an open platform, and the deal was expected to close in the first half of 2027 pending regulatory approval.
On 20 August 2026 SenseTime released SenseNova U1.5-8B-MoT, an open-weight model that generates images natively up to 4096x4096 pixels, after a preview in July.
On 7 July 2026 Meta Superintelligence Labs introduced Muse Image and Muse Video, its first media generation models. Muse Image launched in Meta's apps, while Muse Video entered early preview.
On 3 July 2026 Shengshu released Vidu S1, a real-time interactive video generation model that takes voice input during a video call and changes a character's expression, gestures and body movement in response.
In May 2026 The Standard reported that StepFun had completed a funding round of about US$2.5 billion ahead of a planned Hong Kong listing, after converting into a joint-stock company in April.
In May 2026 Baidu's chip unit Kunlunxin began IPO guidance for China's STAR Market while keeping its Hong Kong plan, as revenue grows and losses narrow toward break-even.
On 21 April 2026 OpenAI released gpt-image-2, an image model that generates and edits pictures from text and image inputs and appears in ChatGPT as ChatGPT Images 2.0. It replaced the GPT Image 1 line and was later revised as versions 2.5 and 2.6.
Midjourney released the V8 alpha on 17 March 2026, generating images about five times faster, with a native 2K --hd mode, improved text rendering, new prompt parameters and a Grid Mode interface. Point releases followed later that year.
PixVerse closed a Series C led by CDH Investments on 12 March 2026, saying the round made it a global AI unicorn and was Asia's largest in AI video generation. It reported more than 100 million users.
On 12 February 2026 Zhipu released GLM-5, a 744-billion-parameter open model under the MIT License. It uses DeepSeek Sparse Attention, and its pre-training data grew from 23 trillion to 28.5 trillion tokens.
On 11 February 2026 iFlytek released Spark X2, a large model trained entirely on domestic computing power and aimed at education, healthcare, automotive and agent use cases.
On 2 February 2026 SpaceX acquired xAI in an all-stock deal. A memo to employees put the combined company at $1.25 trillion, and LSEG data showed it to be the largest merger on record. The AI unit was renamed SpaceXAI in July 2026.
On 29 January 2026 Alibaba's chip unit T-Head listed the Zhenwu 810E, formally revealing a PPU accelerator the company had kept under wraps and completing its combination of Qwen models, cloud and chips.
Biren Technology listed on the Hong Kong Stock Exchange's main board on 2 January 2026, drawing 23 cornerstone investors to its share offering, with its market value briefly passing HK$100 billion on the first trading day.
TSMC's CoWoS advanced packaging places logic dies and HBM stacks on a silicon interposer; capacity remains sold out, and TSMC is expanding in Tainan and Chiayi while developing panel-level CoPoS.
